FabRapid
MATERIAL

Copper

Highly conductive metal with excellent thermal and electrical properties. Pure copper (C101, C110) is essential for heatsinks, busbars, and electrical contacts.

LEAD TIMEAs Fast As 3 Days
QUALITYISO 9001 Certified
QUOTINGInstant Online Quotes
SHIPPINGGlobal Delivery

About Copper

Copper is the gold standard for thermal and electrical conductivity, with the highest conductivity of any engineering metal (401 W/m·K thermal, 59.6 MS/m electrical). These properties make it essential for heatsinks, busbars, electrical contacts, and RF/microwave components.

FabRapid machines oxygen-free high-conductivity (OFHC C101) and electrolytic tough pitch (ETP C110) copper for applications where maximum conductivity is required. We also work with tellurium copper (C145) when improved machinability is needed with only a minor conductivity reduction.

Copper is moderately challenging to machine — its softness and ductility can cause burring and gummy chip formation. Our machinists use sharp tooling with high positive rake angles and appropriate feeds to produce clean, burr-free copper parts.

Material Properties

Density8.96 g/cm³
Tensile Strength210 MPa
Hardness45 HB
Thermal Conductivity401 W/m·K
Melting Point1085 °C

Available Surface Finishes

Surface treatments compatible with Copper.

Common Applications

Heatsinks and thermal management
Electrical busbars and contacts
RF and microwave components
Welding electrodes

Design Guidelines for Copper

1

Specify C145 (tellurium copper) instead of C101 when machinability is more important than maximum conductivity

2

Minimum wall thickness: 0.5 mm — copper is soft and thin walls can deform during machining

3

Avoid sharp edges — copper burrs easily; specify chamfers or radiused edges

4

For soldering applications, specify bare copper without any surface coating in solder joint areas

Copper FAQ

C101 (OFHC) is oxygen-free high-conductivity copper with 99.99% purity and 101% IACS conductivity. C110 (ETP) is electrolytic tough pitch copper with 99.9% purity and 100% IACS conductivity. C101 is required for vacuum and hydrogen applications where oxygen content matters; C110 is sufficient for most electrical applications.

Yes, pure copper and copper alloys can be 3D printed via DMLS/SLM and binder jetting. However, copper is challenging for laser-based processes due to its high reflectivity and thermal conductivity. Green laser systems and specialized parameters are required for reliable results.

Copper naturally develops a patina (tarnish) over time. To prevent this, parts can be clear-coated with lacquer, electroplated with nickel or tin, or treated with anti-tarnish chemical conversion coatings. For electrical applications, tin or nickel plating is the standard approach.

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